Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange
Description:
Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
Advantages:
1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity
Product Properties:
| Grade |
Density g/cm3 |
Coefficient of thermal
Expansion ×10-6 (20℃)
|
Thermal conductivity W/(M·K) |
| CMC111 |
9.32 |
8.8 |
305(XY)/250(Z) |
| CMC121 |
9.54 |
7.8 |
260(XY)/210(Z) |
| CMC131 |
9.66 |
6.8 |
244(XY)/190(Z) |
| CMC141 |
9.75 |
6 |
220(XY)/180(Z) |
| CMC13/74/13 |
9.88 |
5.6 |
200(XY)/170(Z) |
Application:
Cu/Mo/Cu(CMC) carrier has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
Product picture:
